Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in 2.1D/2.5D IC Packaging Technologies
High-Frequency Module Application Using Redistribution Layer Technology
Motoaki Tani, Masaru Sato
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2015 Volume 18 Issue 3 Pages 156-160

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