Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Dissimilar Materials Bonding
Hybrid Bonding Technology at Low Temperature and Atmospheric Pressure for Multi-Field Applications
Akitsu Shigetou, Yusuke Kajihara
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2016 Volume 19 Issue 2 Pages 120-126

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HYBRIDS

Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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