Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Volume 19, Issue 2
Displaying 1-14 of 14 articles from this issue
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Preface
Special Articles / Dissimilar Materials Bonding
Technical Paper
  • Investigation on Wire delamination Mechanism Made on Flexible Wiring Substrates with Electroless Nickel Plating Seed Layer
    Makoto Kohtoku, Yaichiro Nakamaru, Hideo Honma, Osamu Takai
    2016 Volume 19 Issue 2 Pages 132-140
    Published: 2016
    Released on J-STAGE: June 01, 2016
    DOIhttps://doi.org/10.5104/jiep.19.132
    JOURNAL FREE ACCESS
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    We previously reported on a flexible copper-clad laminate having high peel strength that was fabricated using electroless-plating of a Ni-seed layer on polyimide. However, the wiring delaminated from the polyimide surface during the circuit formation process. Alkali from the resist stripping process was observed to penetrate the Ni plating and polyimide interface, after which the Ni plating was corroded by the acidic solution causing the wiring to delaminate. The surface modified layer thickness on the polyimide formed for the electroless Ni plating was related to the penetration under the wiring by the alkali. Wire delamination could then be prevented by thinning the surface modified layer to the nanometer scale.
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