Shimatsu Laboratory, FRIS/RIEC, Tohoku University

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

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Shimatsu Laboratory, FRIS/RIEC, Tohoku University

Takehito Shimatsu

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2017 Volume 20 Issue 6 Pages 425

DOI https://doi.org/10.5104/jiep.20.425

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© 2017 The Japan Institute of Electronics Packaging

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging

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