Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in Material and Processes of Semiconductor Packages for the Next-Generation Electronics
The Insulating Materials for High Density Wiring Formation on Next Generation’s IC Package
Genjin Mago
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2018 Volume 21 Issue 3 Pages 198-201

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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