Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in Material and Processes of Semiconductor Packages for the Next-Generation Electronics
The Modern Technology Trend of Solder Resist and Interlayer Insulating Material for Printed Circuit Boards
Shoji Inagaki
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2018 Volume 21 Issue 3 Pages 202-206

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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