Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Trends and Future Prospects on System-Design Integration based on Hyper-Miniaturization, 3D-Integration and Advanced Packaging
Kazuya OkamotoRyohei Sato
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2018 Volume 21 Issue 6 Pages 531-541

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© 2018 The Japan Institute of Electronics Packaging
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