Development of Embedded Organic Module, EOMIN^TM (Embedded Organic Module Involved Nanotechnology)

Abstract

The coming generations of portable products require further miniaturization, due to the demand for higher density of functions, and increasing signal frequencies. In order to satisfy these requirements, we have developed a new hardware technology for module products, called EOMIN^TM (Embedded Organic Module Involved Nanotechnology). EOMIN^TM features the use of a copper plate as a core material. This copper core has beneficial properties such as high heat dissipation and high rigidity. In this paper, we describe the EOMIN^TM structure, process flow, thermal performance and the reliability of connections to embedded components.