Fabrication of Conductive Patterns on Organic Film with Copper Nano-Ink

Abstract

In this study, we demonstrated the fabrication of conductive patterns on organic film using a photo-sintering process with copper nano-ink. The resistivity of the photo-sintered copper film was 4 μΩ･cm, which was twice as much as bulk copper. The peel strength of electrodeposited copper on the photo-sintered copper film reached 10 N･cm^-1, which was good adhesion to polyimide. The copper metal mesh on hard coat polyethylene terephthalate fabricated using gravure offset printing and photo-sintering of the printed copper nano-ink showed more than 25 pF of electrical capacitance and behaved as a touch sensor on a touch panel module.