Investigation on Temperature Acceleration in Insulation Reliability of Printed Wiring Board

Abstract

We evaluated the effects of temperature on the acceleration of performance in an electrochemical migration (ECM) reliability test of an FR-4 type printed wiring board (PWB). We evaluated the accelerated test conditions from 30°C to 140°C. Our test showed that the ECM failure mode at 30°C was different from the ECM failure mode at 85°C to 140°C.

The actual failure time of the test result at 30°C was shorter than the failure time extrapolated to the failure time from 85°C to 140°C. This is because the temperature does not accelerate at temperatures between 30°C and 140°C, so it did not conform to the Arrhenius equation.