Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Development of the Shoes Equipped with Sensor Modules for Behavior Sensing
Takeaki ShimanouchiTakashi KatsukiOsamu ToyodaMotoaki Tani
Author information
JOURNAL FREE ACCESS

2018 Volume 21 Issue 7 Pages 662-668

Details
Abstract

We have developed a sensor module for behavior sensing. The sensor module consists of a microcomputer, a communication module, some sensors and a battery. Data are acquired using the sensors and sent to a smartphone in real time by the communication module. The data collected were 3-axis acceleration, 3-axis angular velocity, 3-axis geomagnetism, 3 pressures, bending, atmospheric pressure, and temperature-humidity. It was operated for about 42 hours using a 325 mAh battery. Two sensor modules were put in the insoles of a pair of shoes with the cap type packaging cases. The motion of both shoes was monitored using the two insoles and the acquired data showed that human behavior sensing was possible.

Content from these authors
© 2018 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top