2018 Volume 21 Issue 7 Pages 669-675
It is difficult to heat and cool electronic components both uniformly and rapidly because of the low heat conduction of the materials used, for example resin or ceramics. We have developed a new rapid thermal-fatigue test system utilizing an original basic principle where a temperature-controlled air shower is circulated around test bodies to realize both uniform and rapid temperature control even with the simple test apparatus. For a practical electronic circuit board, it was confirmed that the proposed system allowed the target temperature to be approached rapidly while maintaining a uniform temperature distribution. In this paper, using temperature profiles from practical electronic components having larger volume and heavier weight, which are usually hard to heat and cool both rapidly and uniformly, we confirmed that the developed apparatus is able to rapidly approach the target temperature with a uniform temperature distribution in spite of the large internal heat mass.