Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in Heat Dissipation Material and Heat Measurement Techniques
Development of AlN Whisker Fillers to Improve the Thermal Conductivity of Resin Materials
Toru Ujihara
Author information
JOURNAL FREE ACCESS

2019 Volume 22 Issue 3 Pages 195-198

Details
Article 1st page
Content from these authors
© 2019 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top