Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in Heat Dissipation Material and Heat Measurement Techniques
High Thermal Conductivity Epoxy Resins with Rigid Chemical Structure
Miyuki Harada
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2019 Volume 22 Issue 3 Pages 199-204

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