Thermal Material for PCB Substrate and Its Measurement Method

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Special Articles / Latest Trends in Heat Dissipation Material and Heat Measurement Techniques

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2019 Volume 22 Issue 3 Pages 205-208

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