BT Resin Technology Designed for Advanced Electronic Materials

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Material and Elemental Technology

BT Resin Technology Designed for Advanced Electronic Materials

Tsuyoshi Kida

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2019 Volume 22 Issue 5 Pages 385-389

DOI https://doi.org/10.5104/jiep.22.385

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© 2019 The Japan Institute of Electronics Packaging

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

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