Journal of The Japan Institute of Electronics Packaging

Volume 22, Issue 5

Displaying 1-28 of 28 articles from this issue

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Preface

Board Member Re-Acceptance Speech ~ Now is the Best Time to Show JIEP’s Significance ~

Kuniaki Otsuka

Article type: Preface
2019 Volume 22 Issue 5 Pages P5
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.P5

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Special Articles / Trend of Cutting Edge System Integration Technology

(Title page)

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 359
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.359

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Introduction to the Special Edition

Toshihisa Nonaka

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 360
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.360

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Interposer Technology

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Osamu Shimada

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 361-366
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.361

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Hetero-Generous Integration Using Organic Interposer

Kiyoshi Oi, Noriyoshi Shimizu, Toshinori Koyama

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 367-373
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.367

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Advanced Packaging Technology

3D IC Stacking Technology for Reducing Power Consumption of Logic LSI System

Masahiro Aoyagi, Katsuya Kikuchi

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 374-379
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.374

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Expanding of Fan Out Wafer Level/Panel Level Package Technology and the Promising Future

Toshihisa Nonaka

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 380-384
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.380

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Material and Elemental Technology

BT Resin Technology Designed for Advanced Electronic Materials

Tsuyoshi Kida

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 385-389
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.385

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Synergistic Effect in Liquid Crystal Polymeric Composite and Inorganic Filler on Its Highly Thermal Conductivity Equal to That of Magnesium Oxide, and Its Low Thermal Expansion Less than That of Quartz

Takeshi Fujiwara, Takafumi Kuninobu, Kento Ujiiye, Kazuhiro Takizawa

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 390-394
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.390

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Ultrasonic Bonding Technology for Micro System Integration

Kiyokazu Yasuda

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 395-399
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.395

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Equipment and Process Technology

Technology Trends for Chip Thinning Process

Shinya Takyu

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 400-404
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.400

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Fan-out Package Substrate Wiring Technology Solution for Heterogeneous Integration SiP

Yasuhiro Morikawa

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 405-410
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.405

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Packaging Solution for Large Format WLP/PLP

Hiroki Oshida

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 411-416
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.411

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Planarization Technology for Fine Patterning on Next Generation Package Substrate

Katsuhiko Suzuki

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 417-421
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.417

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Progress and Perspective of Wire Bonding Technology

Mitsuaki Sakakura

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 422-426
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.422

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Design, Signal Integrity and Power Integrity

Challenge of Assembly Design for Increasing Package Complexity

Masanori Natsuaki, Masao Oshima

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 427-431
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.427

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EM Simulation of Hi-Speed and Hi-Density Package

Shigekazu Hino, Yasuhiko Odate

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 432-435
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.432

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Introducing Channel Performance Metric A New Definition of Interconnect Signal Integrity Performance

Akinori Mizumura

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 436-443
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.436

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Advancement of Power Integrity Utilizing Device Embedded Technology

Katsuya Kikuchi, Masahiro Aoyagi

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 444-449
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.444

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Applications

New Materials Exploration Using Materials Informatics

Masahiko Ishida

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 450-453
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.450

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What will the Fusion of Electronics and Cosmetics Produce?

Yasuo Kato

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 454-458
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.454

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Motion Data Acquisition and Behavior Estimation using the Small Sensor Module

Takeaki Shimanouchi

Article type: Special Articles
2019 Volume 22 Issue 5 Pages 459-462
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.459

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Announcement, Contents, etc.

[title in Japanese]

Article type: Announcement
2019 Volume 22 Issue 5 Pages 463-465
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.463

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News

Article type: Announcement
2019 Volume 22 Issue 5 Pages 466-468
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.466

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Announcement

Article type: Announcement
2019 Volume 22 Issue 5 Pages A51-
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.A51

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Contents

Article type: Announcement
2019 Volume 22 Issue 5 Pages C51
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.C51

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Contents (in English)

Article type: Announcement
2019 Volume 22 Issue 5 Pages C52
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.C52

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Instruction for Authors

Article type: Announcement
2019 Volume 22 Issue 5 Pages I51-
Published: August 01, 2019
Released on J-STAGE: August 01, 2019

DOIhttps://doi.org/10.5104/jiep.22.I51

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