Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Advanced Electronics and Packaging Technology in AIST
Ultra-Compact Device-Manufacturing-System “Minimal Fab” Integrating Wafer and Packaging Process for High-Mix Low-Volume Productions and Its Packaging Applications
Fumito Imura, Sommawan Khumpuang, Hisatoshi Hirai, Michihiro Inoue, Shiro Hara
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2019 Volume 22 Issue 6 Pages 507-513

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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