Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
2018 JIEP Award-Technical Development
Development of Chip-Scale Silicon Photonic Optical Transceiver: “Optical I/O Core”
Kazuhiko KurataKeizo KinoshitaMitsuru KuriharaYasuhiko HagiharaKenichiro YashikiDaisuke OkamotoTakanori ShimizuKoichi TakemuraMasatoshi TokushimaTsuyoshi Horikawa
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2019 Volume 22 Issue 6 Pages 551-558

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Abstract

We have developed a highly-miniaturized Si photonic transceiver module named "Optical I/O Core" for use in on-board and co-packaged optics. In an optical I/O structure called "optical pin", a laser diode and a driver IC are mounted on a 5 mm × 5 mm photonic integrated circuit. The data rate is 25 Gbps and the transmission media is a multimode fiber. High-temperature operation up to 85°C and multimode fiber links to alleviate alignment tolerance make the optical I/O core usable for various applications. In 2017, AIO Core Co., Ltd. was established to put the developed optical I/O core to practical use. A mass-production line is currently under development.

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© 2019 The Japan Institute of Electronics Packaging
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