Design Method with Regression Analysis to Fulfill Cooling Performance and Lightweight Requirements of Electronics

Abstract

In the development of LED lighting and power electronics products, the high output characteristics needed to enhance their performance leads to a temperature rise of the semiconductor elements. Although it is necessary to attach heat sinks to semiconductor chips in order to prevent the chip temperature from rising excessively, it is also desirable for heat sinks to be as light as possible in order to reduce costs. Therefore, we propose a design method for cooling components to reduce their weight while keeping the chip temperature low based on applying a regression formula of the temperature-containing variables related to the size of the components. This paper demonstrates the effectiveness of this design method by comparing measurement data from LED lamps and the predicted value derived from this method.