Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules

Abstract

This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which induce repeated thermal stress due to the mismatch in the coefficients of thermal expansion of the constituent materials. Thus, thermal fatigue phenomena are critical issues for the structural integrity of power modules. In the present paper, we also deal with the evaluation methodologies for thermal fatigue in the temperatures over 200°C, which are expected operational temperatures for wide bandgap semiconductor power modules. We also propose a research methodology for confirming the structural integrity of power modules in the design phase.