Particle Removal Technology for Semiconductor Chips by Using the Hydrogenated Ultrapure Water and Wiping Process

Abstract

The authors studied particle removal technology for semiconductor chips. Particles on semiconductor chips have been an obstacle to the practical use of direct bonding for chip level. The particles are mainly silicon-based dicing dust and organic matter.

Concretely, we have developed a new particle-removal technology using hydrogenated ultrapure water and a wiping process.