Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Simulation Technologies of Electronics Packaging
Simulation for Lifetime Prediction of the High Temperature Power Modules Using Silver Sintering Die Attach Technology
Kenichi Ohura, Kenji Iseya
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2022 Volume 25 Issue 6 Pages 569-576

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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