Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Simulation Technologies of Electronics Packaging
Problems on Three-Dimensional Thermo-Fluid Simulation around Semiconductor Packages and Trends on Compact Thermal Model Development of Semiconductor Packages
Koji Nishi
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2022 Volume 25 Issue 6 Pages 577-582

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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