Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Integrated Optical Device Module Packaging Technology for 50 Tb/s Ultra-Large Capacity Network Switch Generation
Near Infrared Light-Induced Self-Written Optical Waveguide and Its Application for Multi-Channel Waveguides
Hidetaka Terasawa, Tsuyoshi Namekawa, Keisuke Kondo, Okihiro Sugihara
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2023 Volume 26 Issue 3 Pages 262-265

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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