Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Tutorial Series-3D Integration & Packaging Course / (4)
Chip-to-Chip Interconnection Technology Using Micro Bump Joints
Masahiro Aoyagi
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2023 Volume 26 Issue 3 Pages 293-299

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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