Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Trend of 3D - Chiplet Integration Technology
BBCube 3D Integration Technology Utilizes WOW and COW Hybrid Processes
Takayuki Ohba, Norio Chujo, Hiroyuki Ryoson, Tatsuya Funaki
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2023 Volume 26 Issue 4 Pages 348-355

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HYBRIDS

Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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