Journal of The Japan Institute of Electronics Packaging

Volume 26, Issue 4

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Preface

Solving Social Issues by Electronics Packaging

Akira Fujisaki

Article type: Preface
2023 Volume 26 Issue 4 Pages P4
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.P4

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2023 JIEP Award

2023 JIEP Award

Article type: 2023 JIEP Award
2023 Volume 26 Issue 4 Pages 315-324
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.315

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Special Articles / Trend of 3D - Chiplet Integration Technology

Introduction to the Special Edition

Yasumitsu Orii

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 325
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.325

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R&D of 3D-IC Technology for System Integration

Katsuya Kikuchi

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 326-332
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.326

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Chiplet Concept and Rapid Prototyping of 3D-IC

Takafumi Fukushima

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 333-340
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.333

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Chiplet Integration Technology by Suspended Bridge Architecture

Yoichiro Kurita

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 341-347
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.341

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BBCube 3D Integration Technology Utilizes WOW and COW Hybrid Processes

Takayuki Ohba, Norio Chujo, Hiroyuki Ryoson, Tatsuya Funaki

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 348-355
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.348

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Pixel-Parallel 3D Integrated CMOS Image Sensors Using Direct Bonding of SOI Wafers

Masahide Goto

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 356-360
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.356

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High-Density Package Substrate Using Organic Interposer

Shota Miki, Kosuke Tsukamoto, Yuta Sakaguchi, Atsunori Kajiki

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 361-366
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.361

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Establishment of “JOINT2” Consortium for Next Generation Semiconductor Package Evaluation and Development of Packaging Technology

Keiko Ueno, Sadaaki Katoh

Article type: Special Articles
2023 Volume 26 Issue 4 Pages 367-373
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.367

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Tutorial Series-3D Integration & Packaging Course / (5)

Hybrid Bonding for 3D Integration

Masahisa Fujino

Article type: Tutorial Series
2023 Volume 26 Issue 4 Pages 374-379
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.374

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Report

Koshiji Laboratory, Electrical and Electronics Course, Faculty of Engineering, Tokyo Polytechnic University

Fukuro Koshiji

Article type: Report
2023 Volume 26 Issue 4 Pages 380
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.380

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement
2023 Volume 26 Issue 4 Pages 381
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.381

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The 12th Regular Meeting

Article type: Announcement
2023 Volume 26 Issue 4 Pages 382-406
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.382

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News

Article type: Announcement
2023 Volume 26 Issue 4 Pages 407-410
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.407

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Announcement

Article type: Announcement
2023 Volume 26 Issue 4 Pages A41-
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.A41

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Contents

Article type: Announcement
2023 Volume 26 Issue 4 Pages C41
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C41

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Contents (in English)

Article type: Announcement
2023 Volume 26 Issue 4 Pages C42
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C42

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Instruction for Authors

Article type: Announcement
2023 Volume 26 Issue 4 Pages I41-
Published: July 01, 2023
Released on J-STAGE: July 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.I41

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