Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
The Forefront of Bonding Technology and Expansion to Mounting/Packaging Technology
Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices
Eiji Higurashi
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2023 Volume 26 Issue 5 Pages 427-433

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