Journal of The Japan Institute of Electronics Packaging

Volume 26, Issue 5

Displaying 1-26 of 26 articles from this issue

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Preface

Jisso Technology, Connecting New Functions, Connecting New People

Shintaro Yamamichi

Article type: Preface
2023 Volume 26 Issue 5 Pages P5
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.P5

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Special Articles / The Frontiers of Micro-Mechatronics

(Title page)

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 411
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.411

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Introduction to the Special Edition

Akinobu Yamaguchi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 412
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.412

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The Forefront of Bonding Technology and Expansion to Mounting/Packaging Technology

Self-Propagating Exothermic Function in Metallic Multilayered Films and Its Reactive Bonding Applications

Takahiro Namazu

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 413-419
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.413

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Points to Consider in Measuring Thermal Conductivity of Heat-Dissipating Materials

Shugo Miyake, Tetsuya Ohtsuki, Kimihito Hatori

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 420-426
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.420

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Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices

Eiji Higurashi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 427-433
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.427

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Effect of Water on Wafer Bonding Interface

Kai Takeuchi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 434-440
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.434

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Direct Bonding Techniques of Semiconductor Devices and Thermally Conductive Materials

Takashi Matsumae, Hitoshi Umezawa, Yuichi Kurashima, Hideki Takagi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 441-447
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.441

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Understanding of Sintered Silver Die Layer Degradation Mechanism toward the Realization of High-Power Density Power Modules

Keisuke Wakamoto

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 448-453
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.448

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Trends and Challenges in Wide-Band-Gap Power Semiconductors Packaging

[in Japanese]

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 454-459
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.454

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The Forefront of Inspection Technology and Development to Operand Analysis

Non-Contact Electrical Semiconductor Inspection Technology in Micro Areas Using Photoelectron Beams from Semiconductor Photocathodes

Tomohiro Nishitani

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 460-466
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.460

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Advances in Magnetic Sensors and Nondestructive Testing Applications

Hiroaki Kikuchi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 467-471
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.467

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Introduction to Synchrotron Radiation Photoemission Electron Microscopy~Toward Application to Electronics Devices~

Takuo Ohkochi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 472-476
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.472

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2D X-Ray Irradiation Beamline BL8S2 at Aichi Synchrotron Radiation Center

Ikuya Sakurai, Kenji Hanada

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 477-482
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.477

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The Development of Microsystems and Their Application and Deployment

Microprocessing Using X-Ray Lithography in NewSUBARU

Sho Amano

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 483-487
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.483

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Creation and Application of Nano/Microsystems Integrated with Molecular Sensing

Akinobu Yamaguchi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 488-496
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.488

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Development of Lab on a Disk for Quick Testing System

Yoshiaki Ukita

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 497-501
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.497

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The Development and Application of New Next-Generation Functional Materials

Preparation of Oxidation-Responsive Water-Permeable Membrane

Kaito Tani, Kenji Iimura, Shin-ichi Yusa

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 502-505
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.502

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Research Trend in Nanostructures to Ensure Traceability of Logistics

Takao Fukuoka, Toshiya Yasunaga, Akinobu Yamaguchi

Article type: Special Articles
2023 Volume 26 Issue 5 Pages 506-512
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.506

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Report

ICEP2023セッションサマリー

Article type: Report
2023 Volume 26 Issue 5 Pages 516-522
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.516

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Announcement, Contents, etc.

[title in Japanese]

Article type: Announcement
2023 Volume 26 Issue 5 Pages 513-515
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.513

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News

Article type: Announcement
2023 Volume 26 Issue 5 Pages 524
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.524

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Announcement

Article type: Announcement
2023 Volume 26 Issue 5 Pages A51-
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.A51

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Contents

Article type: Announcement
2023 Volume 26 Issue 5 Pages C51
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C51

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Contents (in English)

Article type: Announcement
2023 Volume 26 Issue 5 Pages C52
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C52

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Instruction for Authors

Article type: Announcement
2023 Volume 26 Issue 5 Pages I51-
Published: August 01, 2023
Released on J-STAGE: August 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.I51

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