Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
The Forefront of Bonding Technology and Expansion to Mounting/Packaging Technology
Direct Bonding Techniques of Semiconductor Devices and Thermally Conductive Materials
Takashi Matsumae, Hitoshi Umezawa, Yuichi Kurashima, Hideki Takagi
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2023 Volume 26 Issue 5 Pages 441-447

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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