Trends and Challenges in Wide-Band-Gap Power Semiconductors Packaging

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

The Forefront of Bonding Technology and Expansion to Mounting/Packaging Technology

[in Japanese]

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2023 Volume 26 Issue 5 Pages 454-459

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[in Japanese]

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