Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Tutorial Series–3D Integration & Packaging Course / (8)
3D Stacking Process Technologies for Advanced CMOS Image Sensors
Hayato Iwamoto, Yoshihisa Kagawa
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2024 Volume 27 Issue 1 Pages 163-168

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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