Verifications and Considerations to Establish Highly Accurate Compact Thermal Model for Semiconductor Packages—Requirements for Surface Mount Type Discrete Power Semiconductor Package Model Creation—

Abstract

In this paper, the compact thermal model of DPAK package, one of surface-mount type discrete power semiconductor packages, is targeted and is created with a conventional methodology and its temperature prediction accuracy is verified. It is found that the compact thermal model created with adequate region setting and evaluation function shows excellent junction temperature prediction accuracy with ~0.1°C/W prediction error compared to 3-dimensional detailed thermal model. Also, it becomes clear that temperature accuracy trend of the compact thermal model is different from that of the three-dimensional detailed thermal model. After that, boundary condition set, which is applied for the compact thermal model creation is discussed as a requirement which enables highly accurate temperature prediction.