Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Supporting Advanced Packaging and World-Leading Material Technologies
Bonding Strength Evaluation of Sub-Micron Au Particle Bumps for High Density Packaging
Yuichi Makita, Akihito Fujino, Kenichi Inoue
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2024 Volume 27 Issue 5 Pages 392-397

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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