Journal of The Japan Institute of Electronics Packaging

Volume 27, Issue 5

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Preface

Thinking about What We Need for the Revival of Japan’s Semiconductor Industry

Takeyasu Saito

Article type: Preface
2024 Volume 27 Issue 5 Pages P5
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.P5

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Supporting Advanced Packaging and World-Leading Material Technologies

(Title page)

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 373
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.373

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Introduction to the Special Edition

Akihiko Happoya

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 374
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.374

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Development of Fabrication Technology for Large 2.5D Packages

Kosuke Murai, Kazue Hirano, Dongchul Kang

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 375-384
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.375

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Fabrication of Two-Types Panel-Level Interposers with Fine Cu Wirings and Outstanding Electrical Reliability

Masashi Minami, Katsuaki To, Daisuke Yamanaka, Ai Yokokura, Sadaaki Ka ...

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 385-391
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.385

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Bonding Strength Evaluation of Sub-Micron Au Particle Bumps for High Density Packaging

Yuichi Makita, Akihito Fujino, Kenichi Inoue

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 392-397
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.392

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Low-Temperature Bonding Materials and Insulation Materials for High-Density 3D Packaging

Hirokatsu Sakamoto

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 398-403
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.398

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Highly Dispersible and Low-Temperature Sinterable Submicron Cu Particles

Takaaki Eyama, Shuichi Inaya, Ukyo Suzuki, Taiki Fukuda, Ryo Nakanishi ...

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 404-409
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.404

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Development of Fluxless Micro-Bonding and Narrow Gap Filling Process

Keiko Ueno, Takeshi Saito, Ryosuke Kimura, Sadaaki Katoh

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 410-415
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.410

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Development of Materials for Printed Wiring Boards for High-Speed Communication

Naoyuki Kawashima, Toshiaki Kadota

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 416-421
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.416

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Ag Sinter Paste for Convection Reflow Oven

Ryuki Horie

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 422-425
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.422

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Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes

Takashi Yamaguchi, Taiyo Nakamura, Madoka Yamashita, Takashi Tazaki

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 426-432
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.426

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Next-Generation Low-k Dielectric Materials Required for Post-5G and 6G

Daisuke Ito

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 433-437
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.433

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Novel Film Material for RDL Application

Meiten Koh, Kazuyoshi Yoneda, Kazutaka Nakada

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 438-441
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.438

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Development of Nitride Fillers for Thermal Management

Yutaka Fukunaga, Shota Daiki

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 442-447
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.442

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Variation in Sintered Structure and Interconnection Properties of Silver Micro-Fillers with Metal Electrodes Using Binder Chemistry

Takanori Fukushima, Masahiro Inoue

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 448-453
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.448

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Development Trends of Insulating and Processing Materials to Enable Printed Electronics

Katsuyuki Sugihara

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 454-460
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.454

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Heterogeneous Integration of Optical Functional Materials by Micro-Transfer-Printing

Junichi Kamatani, Tomotaka Furuta, Tasuku Nakamura, Shinya Okamoto, Ka ...

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 461-465
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.461

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The Non-Destructive Three-Dimensional Analysis of Crack in Solder Joints Employing by Deep Learning Technique

Masashi Hasegawa, Riri Onizuka, Shin Ogata, Ryusuke Ueki, Masanori Tak ...

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 466-471
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.466

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Local Thickness Control of Resist Mask Using Pad Density Dependence

Toyohiro Aoki

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 472-477
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.472

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Development of Resins for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration

Naoko Araki, Tadashi Fukuda, Takayuki Ohba

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 478-483
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.478

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Precision Cleaning Technology for Advanced Package

Kouhei Yamada, Ching teng Cheng, Atsushi Kouke, Isao Nishi

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 484-490
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.484

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Adhesive Materials for Electronic Components Using Polysilsesquioxane

Manabu Miyawaki, Yoshiki Furukawa, Hidekazu Nakayama, Susumu Miura, Ak ...

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 491-496
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.491

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Technology Trend of CMP Process for Advance Packaging Application

Yasuhiro Ichige

Article type: Special Articles
2024 Volume 27 Issue 5 Pages 497-504
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.497

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Announcement, Contents, etc.

[title in Japanese]

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages 505-507
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.505

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News

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages 508
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.508

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Announcement

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages A51-
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.A51

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Contents

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages C51
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.C51

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Contents (in English)

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages C52
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.C52

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Instruction for Authors

Article type: Announcement, Contents, etc.
2024 Volume 27 Issue 5 Pages I51-
Published: August 01, 2024
Released on J-STAGE: August 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.I51

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