Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Thermal Design & Thermal Simulation
Simulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called “Power Insert,” Aiming For Dual-Side Cooling
Keiji Matsumoto , Daisuke Oshima, Hiroyuki Mori, Sayuri Kohara, Akihiro Horibe
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2025 Volume 28 Issue 5 Pages 406-413

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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