Journal of The Japan Institute of Electronics Packaging

Volume 28, Issue 5

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Preface

Shaping the Future of Electronics Packaging Technology

Hidenobu Nishikawa

Article type: Preface
2025Volume 28Issue 5 Pages P5
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.P5

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Special Articles / Latest Trends in Thermal Management

(Title page)

Article type: Special Articles
2025Volume 28Issue 5 Pages 385
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.385

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Introduction to the Special Edition

Koji Nishi

Article type: Special Articles
2025Volume 28Issue 5 Pages 386
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.386

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Thermal Design & Thermal Simulation

Thermal Design Method Using Heat Dissipation to the Printed Circuit Board for Small Surface Mount Components for Electronic Devices

Yoshinori Aruga

Article type: Special Articles
2025Volume 28Issue 5 Pages 387-392
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.387

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The Revised IEC Standards and Adaptation to the Latest Heat Dissipation Methods

Koichi Hirasawa

Article type: Special Articles
2025Volume 28Issue 5 Pages 393-400
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.393

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Understanding The Heat Transfer Path by Utilizing Thermal Network—Problems in Conventional Thermal Network and Visualization of The Heat Transfer Path by Thermal Impedance Distribution—

Koji Nishi

Article type: Special Articles
2025Volume 28Issue 5 Pages 401-405
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.401

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Simulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called “Power Insert,” Aiming For Dual-Side Cooling

Keiji Matsumoto, Daisuke Oshima, Hiroyuki Mori, Sayuri Kohara, Akihiro ...

Article type: Special Articles
2025Volume 28Issue 5 Pages 406-413
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.406

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A Geometry Thermal Simulation Model, SPTP, of Semiconductor Packages

Yutaka Kumano

Article type: Special Articles
2025Volume 28Issue 5 Pages 414-416
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.414

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ROM Technologies Enabling the Digital Supply Chain of Electronic Devices and the Road to Standardization

Ken Miyazaki, Haruki Takei

Article type: Special Articles
2025Volume 28Issue 5 Pages 417-420
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.417

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Thermal Measurement Technology & Methodology

Thermal Conductivity Measurement of Small Materials used in Electronic Devices by Means of Test Head Style Thermal Resistance Measurement System

Hirotoshi Aoki

Article type: Special Articles
2025Volume 28Issue 5 Pages 421-425
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.421

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Measurement on Thermophysical Properties of Thin Films and Interfaces by Time-Domain Thermoreflectance Method

Takashi Yagi

Article type: Special Articles
2025Volume 28Issue 5 Pages 426-432
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.426

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Prediction and Measurement for Thermal Contact Resistance

Tomoyuki Hatakeyama

Article type: Special Articles
2025Volume 28Issue 5 Pages 433-436
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.433

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A Study on the Measurement Method of Thermal Conductivity Using Thermography

Masashi Tatematsu, Yasushi Kajita, Keiju Iwata, Akito Seko, Masakazu H ...

Article type: Special Articles
2025Volume 28Issue 5 Pages 437-439
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.437

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A Study on the Measurement of Contact Thermal Resistance for Thermal Interface Material

Masakazu Hattori

Article type: Special Articles
2025Volume 28Issue 5 Pages 440-443
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.440

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Thermal Interface Materials & Cooling Technology

Introduction of Thermal Conductive Fillers for Thermal Solutions

Takaaki Tanaka

Article type: Special Articles
2025Volume 28Issue 5 Pages 444-448
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.444

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Graphite-Based Thermal Interface Material and Heat Spreader

Yasushi Nishikawa, Motoaki Kobayashi

Article type: Special Articles
2025Volume 28Issue 5 Pages 449-453
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.449

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Cooling Technology for High Heating Electronics Using Vapor Chamber

Harutoshi Hagino

Article type: Special Articles
2025Volume 28Issue 5 Pages 454-458
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.454

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Development of Vapor Chambers for High-Density Device Packaging: From Spacecraft to Data Centers

Soumei Baba, Kenichiro Sawada, Atsushi Okamoto

Article type: Special Articles
2025Volume 28Issue 5 Pages 459-465
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.459

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Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling

Kohei Yuki, Kazuhisa Yuki, Takuya Ide

Article type: Special Articles
2025Volume 28Issue 5 Pages 466-470
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.466

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Announcement, Contents, etc.

News

Article type: Special Articles
2025Volume 28Issue 5 Pages 472-474
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.472

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Announcement

Article type: Announcement, Contents, etc.
2025Volume 28Issue 5 Pages A51-
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.A51

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Contents

Article type: Announcement, Contents, etc.
2025Volume 28Issue 5 Pages C51
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.C51

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Contents (in English)

Article type: Announcement, Contents, etc.
2025Volume 28Issue 5 Pages C52
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.C52

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Instruction for Authors

Article type: Announcement, Contents, etc.
2025Volume 28Issue 5 Pages I51-
Published: August 01, 2025
Released on J-STAGE: August 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.I51

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