Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Thermal Interface Materials & Cooling Technology
Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling
Kohei Yuki , Kazuhisa Yuki, Takuya Ide
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2025 Volume 28 Issue 5 Pages 466-470

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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