The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography

Atsushi TERAMOTO, Muneo YAMADA, Takayuki MURAKOSHI, Masatoshi TSUKADA, Hiroshi FUJITA

Author information

JOURNAL FREE ACCESS

2007 Volume 10 Issue 7 Pages 528-532

DOI https://doi.org/10.5104/jiep.10.528

Details

Article 1st page

Content from these authors

© The Japan Institute of Electronics Packaging

Favorites & Alerts

Related articles

Recently viewed articles

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top