DSOL技術による新規高密度, 微細ビルドアップ基板の開発

抄録

We have developed a new high-density multilayer technology on Printed Circuit Board (PCB), named Deposited Substrate on Laminate (DSOL) technology. An important feature is the dielectric fabrication, which uses a new photosensitive material; an aromatic fluorene unit bonded epoxy acrylate resin. This resin has good electrical properties, excellent via hole resolution, higher glass transition temperature, and low coefficient of the thermal expansion. Another important feature is the technology, that patterns fine-pitch copper conductors using a semi-additive process with a sputtering method. We have successfully developed a high-density packaging substrate for high-pin-count area array ASIC (Application Specific Integrated Circuit) chips (4000 pins) .