抄録
Pb-free electronic devices have been developed to remove the environmental damage from the human body. This report is related to the heat resistance and the joint reliability of diebonded section with Sn-15Sb solder. A solder bath dipping test for 10 seconds above 250°C leads to the void genelation into Sn-15Sb solder, which tends to increase the thermal resistance with a short time of thermal fatigue test. Furthermore, it should be selected the diebond solder and the back metal of die to keep the solidus temperature of die-bonded section. For the practical reflow soldering of semiconductor devices having Sn-15Sb die-bonded solder, it is essential to propose the reflow profile with the maximum peak temperature below 240°C.
