抄録
We have newly developed fluid-assisted self-aligned assembly technique using Au-Sn solder bump re-flow in assembling multi-channel optical devices in integrated multi-channel optical modules. Packaging throughput has been improved by using this technology because initial offset tolerance in placing optical chips before re-flowing solder bumps has been relaxed and necessity of ambient control has been eliminated. We applied this technology to a hybrid-inte-grated eight-channel SOAG (semiconductor optical amplifier gate) array module and sufficient performance for optical gate systems have been obtained.
