Abstract
Thermal residual stress and warp deformation behavior generates in a semiconductor device were analyzed, concerning with the material properties such as modulus, glass transition temperature and thermal expansion coefficient, using the numerical simulation method based on the thermo-viscoelastic analysis software we developed. In order to decrease the interfacial thermal residual stress between LSI chip and elastomer in a semiconductor device, it is efficient to use the elastomer of which properties are low modulus, high glass transition temperature and low thermal expansion coefficient.
