Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Temperature Effects of Surface Breakdown of Printed Wiring Board
Boxue DUKeizo KATOFutao KANEKOShigeo KOBAYASHI
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2002 Volume 5 Issue 4 Pages 401-404

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Abstract
Surface breakdown phenomenon of printed wiring board was investigated with increasing temperature from 23°C to 150°C. The experiment was carried out by do pulse voltage with the frequencies in the range of 50Hz to 150Hz. Printed wiring boards of epoxy resin laminate have been employed to investigate the effects of the surface temperature, electrode distance and the frequencies of applied voltage on the discharge quantity. The study revealed that the time to breakdown decreases with increasing the temperature, increasing the frequency of applied voltage and decreasing the electrode distance. The characteristics of discharge currents with increased temperature and the electrode distance were discussed by power spectral density of discharge current. The results show that the power spectral density of discharge currents increases with increasing the temperature, and decreasing the electrode distance.
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