Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Development of Build-up Substrate “B2itTM” (Buried Bump Interconnection Technology) with Embedded Passives
Yoshitaka FUKUOKAYuji YAMAGUCHIToru SERIZAWAKazuhiro SHINOZAKIHiroyuki HIRAIKenji SASAOKA
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2002 Volume 5 Issue 7 Pages 622-629

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