Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Multilayered Sheet Device Formation Technology Realizing a Wiring Board With Embedded Passives
Takaaki HIGASHIDA, Daisuke SUETSUGU, Miyuki NAGAOKA, Kenichi YAMAMOTO, Munekazu NISHIHARA, Takashi IMANAKA
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2002 Volume 5 Issue 7 Pages 630-635

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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