Reliability Problem and Structural Analysis in Three Dimension Electronic Packaging and Mobile Equipment, etc.

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Reliability Problem and Structural Analysis in Three Dimension Electronic Packaging and Mobile Equipment, etc.

Nobutaka ITOH, Tadashi TATENO, Mami NAGATAKE, Akira TAKASHIMA, Osamu KAWACHI

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JOURNAL FREE ACCESS

2003 Volume 6 Issue 7 Pages 555-559

DOI https://doi.org/10.5104/jiep.6.555

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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