エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
熱疲労シミュレーションによる鉛フリーはんだヒートサイクル試験期間の適正化
横田 康夫渡辺 正樹
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2004 年 7 巻 1 号 p. 76-81

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Recently, several Pb free solder are introduced on the electric appliance rapidly. But, for the co-existing of enough quality and short development L/T on the electric appliance, it become doubtful whether the existing reliability standard of heat cycle test based on the Sn-Pb solder can be used or not. Therefore, in this paper, in order to reconsider the existing standard, thermal fatigue simulation of Pb free solder with Anand model was carried out and the necessary and minimum heat cycle time for Pb free solder was calculated. In addition to that, the acceleration factors for several solders are compared. As a result of that, it became clear that the necessary and minimum heat cycle time for Pb free solder could be shortened than that of Sn-Pb solder and that the existing reliability standard based on Sn-Pb should be changed.

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