Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
Preparation and Properties of Composite Films Composed of Polyimide, Epoxy Resin and Silver Filler
Takashi MASUKOShinji TAKEDAYuji HASEGAWA
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2005 Volume 8 Issue 2 Pages 116-124

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Abstract

Composite films composed of various polyimides derived from decamethylene bis (trimellitate) anhydride (DBTA), an epoxy resin and a silver filler were prepared and their properties were studied. The films showed thermoplastic behavior before curing with molten performance at high temperatures above their Tgs, and thermosetting behavior after curing with restricted flow behavior even above their Tgs. The limited flow behavior results from the network structure formation in the film. The adhesion strength of the film when used as an adhesive film between two adherents having different thermal strains was affected by two main factors: the modulus and stress relaxation property of the film. In this paper, the relationship between the chemical structure of the polyimides and the various properties of the composite films is discussed.

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